Feature:

This equipment performs 100% inspection for cracks in sintered parts used in automobile parts, etc., using ultrasonic flaw detection.
Since minute cracks are detected and inspected using rust preventive oil, there is no need to worry about rust.
In addition, the combination of parts feeder and index table demonstrates high processing performance.

Specifications:

1) Target work

・Shape: Any Small parts
・Material: Fe-based sintered product
・Dimensions, etc.: 50 mm or less

2) Flaw detection method and inspection performance

・Flaw detection method: Local oil immersion vertical flaw detection method
・Target flaws: Corner cracks, etc.
・Inspection performance: depth 0.3mm x length 2mm slit
・Processing capacity: 3 to 5 seconds/piece or less

Feature:

The HYPER SCAN-M4 ultrasonic inspection multi-system increases productivity with its multi-channel (2CH, 4CH) system. The HYPER SCAN-M4 also offers a full range of software functions to assist in the detection and recognition of defects.

Secifications:

Use Cases

Power modules
Defect detection inside modules
Inspection of solder joint layer on chip/circuit board
Inspection of solder joint layer of base plate/board
Inspection of adhesive resin layer between module and base board
Internal inspection of modules with fins

Ceramic Components/Composite Materials
Ceramic/metal (copper, aluminum) bonding layer inspection
Peeling inspection of electrostatic chuck materials
Inspection of bonding between metal substrate circuits/base
Crack inspection of ceramics.

Software Functions

Partial magnification function When a range is specified in the flaw image, the area in question is enlarged and displayed.
Defect list display Binarizes defects within a specified range and displays a defect list.
Image display of selected defects Color image of selected defects is displayed on the image by specifying the defects in the list.
Dimension measurement function Measures the X,Y length of a rectangular range and the distance between two points.

≪Partial enlargement function≫

≪Specified range defect display≫

≪Rectangular length measurement≫

≪Distance measurement between two points≫

≪Ceramic crack≫

≪Power module solder voids≫

≪Ceramic substrate bonding failure≫