SHINKO SEIKI CO. | Kouei Japan Trading | Get Quotation

Shinko Seiki SF-IIC, SF-IIL, SF-II Assist

kvt part2 — Tue, 03 Nov 2020 08:10:04 +0000

Manufacturer: Shinko Seiki Co., Ltd.
Model: SF-IIC, SF-IIL, SF-II

Features

Measurement is automated via color image processing, thus reducing inconsistencies in measured results.
Measurement data and image data are easily recorded.
Glass strain can be observed using a sensitive color plate.
The image on this page is the newly developed SF-II ASSIST.
SF-II ASSIST (* optional accessory) can support measurement simply by installing in the existing SF-II. It increases the number of positions that can be simultaneously processed to 10 points, which markedly shortens processing time .
Also, SF-II ASSIST can automatically create test reports once measurement data has been saved.
The test reports can be edited anytime with Microsoft® Word software.
* SF-II ASSIST does not come with the SF-II unit. In addition to the software, a CCD camera, image capturing lens and PC are required to use SF-II ASSIST.

Specifications

Measurement method: Senarmont method
Measurement accuracy: 1.6 nm (Double refraction)
Measurement range: 590 nm in primary interference
Measurement view range: φ40 mm
Camera view range: 2×, 4×, close-up mode
Light source: 15 V, 150 W • halogen lamp (SF-IIC), 24 V, 48 W – LED (SF-IIL)

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Shinko Seiki SP Series Polarimeter (Strain Measuring Equipment)

kvt part2 — Tue, 03 Nov 2020 07:42:18 +0000

Manufacturer: Shinko Seiki Co., Ltd.
Model: SP Series

Features

The SP-125, SP-II and SF-II are small-sized, sturdy and portable, and ensure a sharp view and have sufficient accuracy for practical use. Measuring operations and other instrument handling procedures are extremely easy.
The SP-125 and SP-II are equipped with a rotating phase-difference plate for phase difference measurements. It enables a wide measuring range when the standard phase-difference plate is used.
The SF-II adopts the Senarmont method of phase-difference measurement, thus providing a wide measuring range that is particularly useful for measuring plastic materials with a high photoelastic constant.

Specifications

Model	SP-125	SP-Ⅱ	SF-Ⅱ
View range	φ125 mm diameter	φ40 mm diameter	φ40 mm diameter
Measuring range	-120 to +50 nm (Phase difference)	-120 to +50 nm (Phase difference)	0 to ∞ nm (Phase difference)
Measuring accuracy	±1 nm (Phase difference)	±1 nm (Phase difference)	±1.6 nm (Phase difference)
Specimen size	φ280mm×125mmH	φ210mm×100mmH	φ210mm×100mmH
Light source	100V~110V 20 W (Fluorescent lamp)	100V 60W	100V 100 W (halogen lamp)
Size	270 mm (width) × 440 mm (depth) × 470 mm (height)	200 mm (width) × 233 mm (depth) × 400 mm (height)	200 mm (width) × 233 mm (depth) × 400 mm (height)
Weight	Approx. 19 kg	Approx. 9 kg	Approx. 9 kg
Standard accessories	[1] Vinyl cover 1 [2] Phase-difference plate test record 1	[1] Vinyl cover 1 [2] Phase-difference plate test record 1	[1] Vinyl cover 1 [2] Rotation angle table of analyzer 1

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Shinko Seiki ST Series Bearing Chamfer Measuring Projector

kvt part2 — Tue, 03 Nov 2020 07:19:16 +0000

Manufacturer: Shinko Seiki Co., Ltd.
Model: ST Series

Features

Model SL-205LT allows direct readings of inner chamfer diameter dimensions with its scaled screen.
Models ST-200HN and ST-205LT are equipped with each one piece of 20×lens as a standard accessory.
Screen diameter of 200mm is a compact and simple design.
Using halogen lamps and high precision projection lenses, the projector produces sharp and clear projection images.
One-touch inspections of bearing are made possible with specialized tools by installing the projector in bearing manufacturing line.

Specifications

Model	ST-200HN	ST-205LN
Screen	φ200 mm inverted image	φ200 mm erect image
Lens	with 20X lens	with 20X lens
Magnification precisions	Contour illumination: ±0.15%	Surface illumination: ±0.25%
Stage	with a ring retainer Traveling range: X&Z: 50mm Y: 30mm	Sliding system
Primary side power source	AC100V~110V	220~240V
Light source	15 V, 10A, 150 W Halogen lamp	24 V, 12.5A, 300 W Halogen lamp
Power source dimensions	150 (H) × 240 (W) × 240 (D) mm	150 (H) × 240 (W) × 240 (D) mm
Weight of the power source	6kg	9kg
Weight of the main body	52kg	50kg

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Shinko Seiki Vacuum Baking Oven

kvt part2 — Tue, 03 Nov 2020 06:51:51 +0000

Manufacturer: Shinko Seiki Co., Ltd.

Features

Various types of baking ovens are available for degassing and baking various components as well as electronic devices.
This oven can be used with a wide range of wide applications (Si wafer, glass, package components, etc.)

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Shinko Seiki Vacuum Annealing Oven

kvt part2 — Tue, 03 Nov 2020 06:43:47 +0000

Manufacturer: Shinko Seiki Co., Ltd.

Features

This oven uses quartz pipes for baking electronic devices (typically, Si)
Mechanisms can be optimized to the user’s application (thin film alloying, sintering, drying, annealing, etc.).

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Shinko Seiki SVRF Series Vacuum Sintering Furnace

kvt part2 — Tue, 03 Nov 2020 06:21:28 +0000

Manufacturer: Shinko Seiki Co., Ltd.
Model: SVRF Series

Features

Work cassettes are smoothly loaded and unloaded, resulting in improved work efficiency.
The system can be easily configured as a continuous furnace. (2-series furnaces, 4-series furnaces, etc.)
User-specific systems are easily upgraded, in comparison with other types of sintering furnace.
Batch volume is large, which serves mass-production well.

Specifications

Model	SVRF-1535	SVRF-2550	SVRF-3060	SVRF-3090
Operation mode	Fully automatic	Fully automatic	Fully automatic	Fully automatic
Exhaust performance	Ultimate vacuum Pressure : 6.7 × 10^-1Pa, After baking at room temperature under no load	Working pressure: 1 to 10²Pa order	Working pressure: 1 to 10²Pa order	Working pressure: 1 to 10²Pa order
Internal structure	4 plane heaters (2 plane heaters)	4 plane heaters (2 plane heaters)	4 plane heaters (2 plane heaters)	4 plane heaters (2 plane heaters)
Throughput	15 kg/charge	50 kg/charge	100 kg/charge	150 kg/charge
Sintering temperature	900°C~1500°C	900°C~1500°C	900°C~1500°C	900°C~1500°C
Soaking dimensions	W150×H150×D350mm	W250×H250×D500mm	W300×H300×D600mm	W300×H300×D900mm
Soaking accuracy	4 plane heaters: 1500°C±5°C (2 plane heaters: 1500°C±10°C)	4 plane heaters: 1500°C±5°C (2 plane heaters: 1500°C±10°C)	4 plane heaters: 1500°C±5°C (2 plane heaters: 1500°C±10°C)	4 plane heaters: 1500°C±5°C (2 plane heaters: 1500°C±10°C)
Vacuum tank	φ600×800mm	φ700×1100mm	φ1000×1400mm	φ1000×1700mm
Temperature rise time	Up to 1500°C: Within 3 hours	Up to 1500°C: Within 3 hours	Up to 1500°C: Within 3 hours	Up to 1500°C: Within 3 hours
Cooling method	Natural cooling by inert gas sealing	Natural cooling by inert gas sealing	Natural cooling by inert gas sealing	Natural cooling by inert gas sealing

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Shinko Seiki Vacuum Soldering Unit

kvt part2 — Tue, 03 Nov 2020 04:23:17 +0000

Manufacturer: Shinko Seiki Co., Ltd.

Features

This unit melts solder under vacuum to remove voids from the solder.
Since solder is pre-heated in a reduction atmosphere, flux-free soldering is enabled.
Mostly, this unit has been used to manufacture power devices and form bumps for flip chip bonding.

Specifications

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Shinko Seiki POEM Cleaning Unit

kvt part2 — Tue, 03 Nov 2020 04:07:12 +0000

Manufacturer: Shinko Seiki Co., Ltd.
Model: POEM

Features

Despite its compact body, this unit can process large areas (at least 8 inch).
This unit is effective for hydrophilic processing before mounting and for organic film/oxide film removal.
This unit can also be used for resin substrate surface processing.

Specifications

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Shinko Seiki SERIO ICP Plasma Etching Unit

kvt part2 — Tue, 03 Nov 2020 03:44:40 +0000

Manufacturer: Shinko Seiki Co., Ltd.
Model: SERIO

Features

SERIO is a high-density plasma etching unit that renders smoothly etched surfaces by using a high-density ICP plasma source.
It features excellent etching angle controllability that lends itself well to fabricating nano-imprint molds.

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Shinko Seiki SWP Series High-Density Plasma Unit

kvt part2 — Tue, 03 Nov 2020 02:58:58 +0000

Manufacturer: Shinko Seiki Co., Ltd.
Model: SWP Series

Features

The SWP series use surface wave plasma (SWP) to coat large areas in a uniform layer of high-density plasma. The unit has been adopted for ashing and CVD.
It enables damage-free ashing at high rate.

Specifications

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Shinko Seiki EXAM Plasma Etching Unit

kvt part2 — Tue, 03 Nov 2020 02:40:10 +0000

Manufacturer: Shinko Seiki Co., Ltd.
Model: EXAM

Features

Batch type plasma etching unit with 250 × 250 mm processing stage.
This unit can etch quartz as well as silicone, oxide film, and nitride film.

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Shinko Seiki Arc Discharge Type High-Vacuum Ion Plating System

kvt part2 — Tue, 03 Nov 2020 02:17:47 +0000

Manufacturer: Shinko Seiki Co., Ltd.

Features

Using an internally developed method, this system ionizes volatile particles under high vacuum.
The smooth fine film quality has been proven in many applications over many years.

Specifications

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Shinko Seiki PIG Type DLC Film Forming System

kvt part2 — Tue, 03 Nov 2020 01:57:59 +0000

Manufacturer: Shinko Seiki Co., Ltd.

Features

Using an internally developed PIG plasma source, this system can form smooth DLC film at high speed.
It is mostly used for surface processing of automotive parts, whose applications are expected to expand in the future.

Specifications

The post Shinko Seiki PIG Type DLC Film Forming System first appeared on Kouei Japan Trading | Get Quotation.

Shinko Seiki Arc Filament Type Lon Plating Equipment (AF-IP Equipment)

kvt part2 — Tue, 03 Nov 2020 01:19:04 +0000

Manufacturer: Shinko Seiki Co., Ltd.

Features

The equipment is an Ion Plating equipment of new method which achieves kinds of coating
(thick film oxidized film・carbonized film etc.) with PVD technology, that previously has been
put to practical use with CVD method only.
“Arc Filament type Ion Plating equipment” performs ionization effectively by impact
between evaporating particle and thermal electron on evaporation source.
In addition, it is able to form kinds of precise reaction film with strong adhesion
(nitride film・oxidized film・carbonized film・carbon nitride film) due to reaction of
supplied gas and ionized evaporating particle.
Moreover, it achieves thick film forming of oxidized film which was difficult to be formed
with existing “Arc discharge type Ion Plating equipment”.
New type PVD coating with Arc Filament type Ion Plating equipment is expected to be utilized
for a lot of applications such as precision metal mold or parts of semiconductor manufacturing equipment.

Specifications

New developed film

Previous film

The post Shinko Seiki Arc Filament Type Lon Plating Equipment (AF-IP Equipment) first appeared on Kouei Japan Trading | Get Quotation.

Shinko Seiki Plasma Polymerization System

kvt part2 — Mon, 02 Nov 2020 14:27:40 +0000

Manufacturer: Shinko Seiki Co., Ltd.

Features

This system forms polymerized films of excellent bio-compatibility.
It lends itself well to mass-production and can be used to develop new applications of thin film forming processes in biological and medical fields.

Specifications

Thin films formed by plasma polymerization add good hydrophilicity and water repellency to various material surfaces, when the optimum type of process gas and film forming conditions are selected.
Since the film forming process is enabled at low temperatures of 50ºC and below, high hydrophilicity can be applied to resin materials.

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Shinko Seiki Plasma CVD System

kvt part2 — Mon, 02 Nov 2020 14:04:15 +0000

Manufacturer: Shinko Seiki Co., Ltd.

Specifications

Target	For production
Allowable processing range	600 × 600 (mm)
Processing time	Approx. 4.5 hours / batch (SiO₂ 15 µm forming process)
Film thickness distribution	560 × 560 (mm) plane: ± 7% or less
Film thickness	15 µm (SiO₂)
Applied gas	Ar, N₂O, SiH₄ (Ar dilution), Nitrogen (For venting / purging)
Main exhaust vacuum pump	Oil diffusion pump (Optional: Turbo-molecular pump)
RF power supply for discharge	13.56 MHz (1.5kW)
Substrate heater	Heating temperature: 360°C ± 10°C (380°C max.)
Operation	Fully automatic operation from touch panel

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Shinko Seiki AMF Series Vapor Deposition Unit For Research And Development

kvt part2 — Mon, 02 Nov 2020 13:39:31 +0000

Manufacturer: Shinko Seiki Co., Ltd.
Model: AMF Series

Specifications

Model	EM– 330S	EM– 435S	AM– 645SB	AMF– 645SB
Film forming system
Throughput	Φ 3 inch: 4 substrates	Φ 3 inch: 5 substrates	Φ 4 inch: 6 substrates	Φ 4 inch: 6 substrates
Film thickness distribution	± 15%	± 15%	± 10%	± 10%
Evaporation method	Resistance heating	Resistance heating	Electron beam gun	Electron beam gun
Substrate heating	350°C	350°C	350°C	350°C
Vacuum pumping system
Ultimate vacuum pressure	10^-4 Pa order	Up to 10^-4 Pa order	10^-5 Pa order	Up to 10^-4 Pa order
Pumping time	Up to 10^-4 Pa order within 20 minutes	Up to 10^-4 Pa order within 15 minutes	Up to 10^-4 Pa order within 20 minutes	Up to 10^-4 Pa order within 20 minutes
Main pump	Oil diffusion pump	Oil diffusion pump	Oil diffusion pump	Oil diffusion pump
Operation mode	Fully automatic	Fully automatic	Vacuum pumping system: Automatic, Film forming system: Manual	Vacuum pumping system: Automatic, Film forming system: Manual

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Shinko Seiki AAMH Series Horizontal Vapor Deposition System

kvt part2 — Mon, 02 Nov 2020 13:15:05 +0000

Manufacturer: Shinko Seiki Co., Ltd.
Model: AAMH Series

Specifications

Model	AAMH– C1075SB	AAMH– C1080SB	AAMH– C2013SB
Film forming system
Throughput	60 x 60 mm substrate: 72	Φ 3 inch: 60 substrates Φ 4 inch: 45 substrates Φ 5 inch: 14 substrates	420 × 275 mm substrate: 8
Film thickness distribution	± 10%	± 15%	± 10%
Evaporation method	Electron beam gun	Electron beam gun	Electron beam gun
Substrate heating	350°C	350°C	350°C
Vacuum pumping system
Ultimate vacuum pressure	5 × 10^-5 Pa or less	6 × 10^-5 Pa or less	7 × 10^-5 Pa or less
Pumping time	Up to 10^-4 Pa order within 15 minutes	Up to 10^-4 Pa order within 15 minutes	Up to 10^-4 Pa order within 25 minutes
Main pump	Cryo pump	Cryo pump	Cryo pump
Operation mode	Fully automatic

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Shinko Seiki Load-Lock Type Vapor Deposition System

kvt part2 — Mon, 02 Nov 2020 06:12:14 +0000

Manufacturer: Shinko Seiki Co., Ltd.

Specifications

Model	AAMF–C845SB–L	AAMF–C1065SB–L	AAMF–C1275SB–L	AAMF–C1260SB–M
Film forming system	Throughput
	φ 2 inch: 6 substrates / dome	φ 3 inch: 10 substrates / dome	φ 4 inch: 10 substrates / dome	φ 8 inch: 20 substrates / cassette
	Film thickness distribution
	± 10%			± 5%
	Evaporation method
	Electron beam gun
	Substrate heating
	350°C
Vacuum pumping system (Film forming chamber)	Ultimate vacuum pressure
Vacuum pumping system (Film forming chamber)	4.0 × 10⁻⁵ Pa or less
	Main pump
	Cryo pump
Operation mode	Fully automatic
Transfer system	Dome transfer			Single wafer transfer (Cassette-to-Cassette)

※ Various user-selected functions are available.

※ In addition to the above, various sizes are available.

The post Shinko Seiki Load-Lock Type Vapor Deposition System first appeared on Kouei Japan Trading | Get Quotation.

Shinko Seiki Vapor Deposition System For Lift-Off Process

kvt part2 — Mon, 02 Nov 2020 05:31:44 +0000

Manufacturer: Shinko Seiki Co., Ltd.

Specifications

Model	AAMF–C1650SBR	AAMF–C2265SBR
Throughput	φ 3 inch: 7 substrates φ 4 inch: 4 substrates	φ 3 inch: 12 substrates φ 4 inch: 12 substrates
Film incident angle	± 3° (within φ 3 inch)	± 4° (within φ 3 inch)
Film thickness distribution	± 5%	± 2.5%
Ultimate vacuum pressure	10⁻⁶ Pa order

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Shinko Seiki AAMF Series Standard Vapor Deposition System

kvt part2 — Mon, 02 Nov 2020 05:02:41 +0000

Manufacturer: Shinko Seiki Co., Ltd.
Model: AAMF Series

Specifications

Model	AMF–C850SPB	AMF–C1065SPB	AAMF–C1275SPB	AAMF–C2280SPB
Model
Film forming system	Throughput
	φ 3 inch: 24 substrates φ 4 inch: 12 substrates	φ 3 inch: 36 substrates φ 4 inch: 18 substrates	φ 4 inch: 48 substrates φ 5 inch: 24 substrates	φ 4 inch: 54 substrates φ 5 inch: 36 substrates
	Film thickness distribution
	± 10%
	Evaporation method
	Electron beam gun
	Substrate heating
	350℃
Vacuum pumping system	Ultimate vacuum pressure
	4.0 × 10⁻⁵ Pa or less
	Pumping time
	Up to 10⁻⁴ Pa order: Within 15 minutes	Up to 10⁻⁴ Pa order: Within 15 minutes	Up to 10⁻⁴ Pa order: Within 20 minutes	Up to 10⁻⁴ Pa order: Within 20 minutes
	Main pump
	Cryo pump
Operation mode	Exhaust system: Automatic, Film forming system: Manual			Fully automatic

※ Various user-selected functions are available.

※ In addition to the above, various sizes are available.

The post Shinko Seiki AAMF Series Standard Vapor Deposition System first appeared on Kouei Japan Trading | Get Quotation.

Shinko Seiki SRV Series Sputtering System For R & D

kvt part2 — Mon, 02 Nov 2020 04:21:34 +0000

Manufacturer: Shinko Seiki Co., Ltd.
Model: SRV Series

Specifications

Load lock type

Model	SRL3320	SDL4320	STL5520
	Parallel plate type	Parallel plate type	Parallel plate type
Target	Cathode type
	Planar magnetron	Planar magnetron	Planar magnetron
	Size × Quantity
	φ 75 mm × 3	φ 100 mm × 3	φ 75 mm × 5
Sputtering direction	Up	Up	Up
Substrate loading capacity	φ 180 mm × 1	φ 200 mm × 1	φ 200 mm × 1
Substrate table	Rotary mechanism
	○	○	○
	Substrate heating
	Substrate table: 300℃	Substrate table: 300℃	Substrate table: 700℃
Film thickness distribution	Within ±5% (φ 50)	Within ±10% (φ 180)	Within ±10% (φ 200)
Transfer method	Transfer rods	Transfer rods	Multiple rods
Vacuum pumping system	Ultimate vacuum pressure
	8.0 × 10⁻⁵ Pa or less	8.0 × 10⁻⁵ Pa or less	8.0 × 10⁻⁵ Pa or less
	Pumping time
	Up to 5.0 × 10⁻⁴ Pa Within 25 minutes	Up to 5.0 × 10⁻⁴ Pa Within 20 minutes	Up to 5.0 × 10⁻⁴ Pa Within 20 minutes
Main pump	Turbo molecular pump	Turbo molecular pump	Turbo molecular pump
Operation mode	Pumping operation
	Automatic	Automatic	Automatic
	Transfer operation
	Manual	Manual	Automatic
Sputtering operation	Semi-automatic (With timer)	Semi-automatic (With timer)	Automatic
Sputtering power supply	RF
	500W	Option	500W
	DC
	—	3kW	3kW
Gas supply system	2 lines	2 lines	2 lines

Batch type

Model	SRV3100	SRV3300	SRV4320
Model	Parallel plate type	Parallel plate type	Parallel plate type
Target	Cathode type
Target	Planar magnetron	Planar magnetron	Planar magnetron
Size × Quantity	φ 75 mm × 1	φ 75 mm × 3	φ 100 mm × 3
Sputtering direction	Up	Down	Up
Substrate loading capacity	φ 100 mm	φ 190 mm	φ 280 mm
Substrate table	Rotary mechanism
		○
	Substrate heating
	Substrate table: 200℃	Substrate table: 300℃	Substrate table: 300℃
Film thickness distribution	Within ±10% (φ 50)	Within ±10% (φ 180)	Within ±10% (φ 200)
Vacuum pumping system	Ultimate vacuum pressure
	5.0 × 10⁻⁴ Pa or less	5.0 × 10⁻⁴ Pa or less	5.0 × 10⁻⁴ Pa or less
	Pumping time
	Up to 9.9 × 10⁻⁴ Pa Within 20 minutes	Up to 9.9 × 10⁻⁴ Pa Within 20 minutes	Up to 9.9 × 10⁻⁴ Pa Within 20 minutes
Main pump	Oil diffusion pump	Oil diffusion pump	Turbo molecular pump
Operation mode	Pumping operation
Operation mode	Manual	Manual	Manual
	Sputtering operation
	Semi-automatic (With timer)	Semi-automatic (With timer)	Semi-automatic (With timer)
Sputtering power supply	RF
Sputtering power supply	500W	500W	1kW
	DC
	—	Option	Option
Gas supply system	1 lines	2 lines	2 lines

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Shinko Seiki STM Series Ultra-High Vacuum Sputtering System

kvt part2 — Mon, 02 Nov 2020 03:34:44 +0000

Manufacturer: Shinko Seiki Co., Ltd.
Model: STM Series

Features

This latest multi-chamber system is applicable with wafers up to 8 inch in diameter.
It is intended for research and development of cutting-edge devices (magnetic devices, nitride semiconductors, oxide semiconductors, etc.)

Specifications

Model	STM2323
Substrate loading capacity	φ 100 mm max.
Equipment configuration	Load-lock chamber: 1 chamber
	Cassette chamber: 1 chamber
	Transfer chamber: 1 chamber
	Sputtering chamber: 3 chamber
Cathode specification	RMC
Sputtering direction	Down
Process performance	Film thickness distribution: Within ±5% (φ 65)
	Etching distribution: Within ±10% (φ 65)
	Substrate heating: 500°C
Ultimate vacuum pressure for each chamber	Load-lock chamber: 8.0 × 10⁻⁶ Pa or less
	Cassette chamber: 4.0 × 10⁻⁶ Pa or less
	Transfer chamber: 1.0 × 10⁻⁷ Pa or less
	Sputtering chamber: 1.0 × 10⁻⁶ Pa or less
Operation mode	Fully automatic C to C sputtering

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Shinko Seiki SDR Series Roll To Roll Sputtering System

kvt part2 — Mon, 02 Nov 2020 02:31:48 +0000

Manufacturer: Shinko Seiki Co., Ltd.
Model: SDR Series

Specifications

Model	SDR series
Substrate width	300 ～ 1000 mm
Substrate thickness	20 ～ 50 µm
Substrate winding diameter	φ 300 mm max.
Substrate core outer diameter	6″ (≈ 150 mm)
Running speed	0.5 ～ 20 m / min
Tension	5 to 50 kgf / overall width
Sputter cathode pre-processing (Option)	4 units max.

※ Various types of resins films and metal foils are applicable as base materials.

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Shinko Seiki Inline Sputtering System

kvt part2 — Sun, 01 Nov 2020 15:49:51 +0000

Manufacturer: Shinko Seiki Co., Ltd.

Features

The equipment configuration can be flexibly changed to the user’s requirements by selecting market-tested models suitable for the intended purposes.
Highly efficient rectangular cathodes are employed to ensure stable performance over extended periods of time.

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Shinko Seiki SRV Series Batch Type Sputtering System

kvt part2 — Sun, 01 Nov 2020 15:28:16 +0000

Manufacturer: Shinko Seiki Co., Ltd.
Model: SRV Series

Features

This series comes in a proven product lineup that allows users to select the best hardware, software and processes for a wide range of applications from research and development of a single substrate to full-scale mass-production.

Specifications

Model	SRV4310	SRV6310	SRV7310
Type	Parallel plate type	Parallel plate type	Parallel plate type
Target
Cathode type	Planar magnetron	Planar magnetron	RMC
Size × Quantity	φ 100 mm × 3	φ 150 mm × 3	φ 200 mm × 3
Sputtering direction	Up	Up	Up
Substrate loading capacity	φ 320 mm	φ 320 mm	φ 520 mm
Substrate table
Rotary mechanism	○	○	○
Substrate heating	Substrate table: 300℃	Substrate table: 300℃	Substrate table: 300℃
Film thickness distribution	Within ±10% (φ210)	Within ±10% (φ300)	Within ±10% (φ420)
Vacuum pumping system
Ultimate vacuum pressure	6.0 × 10⁻⁵ Pa or less	6.0 × 10⁻⁵ Pa or less	6.0 × 10⁻⁵ Pa or less
Pumping time	Up to 9.9 × 10⁴ Pa Within 10 minutes	Up to 9.9 × 10⁴ Pa Within 10 minutes	Up to 9.9 × 10⁴ Pa Within 10 minutes
Main pump	Cryo pump	Cryo pump	Cryo pump
Operation mode
Pumping operation	Automatic	Automatic	Automatic
Sputtering operation	Semi-automatic (With timer)	Semi-automatic (With timer)	Semi-automatic (With timer)
Sputtering power supply
RF	500W	1kW	3kW
DC	Option	Option	Option
Gas supply system	2 lines	2 lines	2 lines

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Shinko Seiki STL Series Load-Lock Type Sputtering System

kvt part2 — Sun, 01 Nov 2020 15:18:45 +0000

Manufacturer: Shinko Seiki Co., Ltd.
Model: STL Series

Features

This system uses three cathodes (φ100 mm), thus is capable of forming multiple films.
Film thickness distribution is φ250 mm ±10%.
Because the transfer chamber and film forming chamber are always kept under vacuum, throughput time can be shortened.
This space-saving load-lock type sputtering unit enables real-time process verification from the touch panel.

Specifications

Model	STL5321	STL5111	STL5311
Type	Parallel plate type	Parallel plate type	Parallel plate type
Target
Cathode type	Planar magnetron	RMC	Planar magnetron
Size × Quantity	φ 100 mm × 3	φ 350 mm × 1	φ 100 mm × 3
Sputtering direction	Down	Up	Up
Substrate loading capacity	φ 27 mm tray × 16	φ 27 mm tray × 16	φ 100 mm wafer × 3
Substrate table
Rotary mechanism	—	Option	○
Substrate heating	Substrate table: 500℃	Substrate table: 500℃	Substrate table: 500℃
Film thickness distribution	Within ±10% (φ210)	Within ±5% (φ200)	Within ±10% (φ90)
Transfer method	Robot	Robot	Telescopic arm
Vacuum pumping system
Ultimate vacuum pressure	Up to 2.0 × 10⁻⁵ Pa	Up to 2.0 × 10⁻⁵ Pa	Up to 2.0 × 10⁻⁵ Pa
Pumping time	Up to 5.0 × 10⁴ Pa Within 20 minutes	Up to 5.0 × 10⁴ Pa Within 20 minutes	Up to 5.0 × 10⁴ Pa Within 20 minutes
Main pump	Turbo molecular pump	Cryo pump	Cryo pump
Operation mode
Pumping operation	Automatic	Automatic	Automatic
Sputtering operation	Automatic	Automatic	Automatic
Sputtering power supply
RF	500W	Option	500W
DC	3kW	15kW	3kW
Gas supply system	2 lines	2 lines	2 lines

The post Shinko Seiki STL Series Load-Lock Type Sputtering System first appeared on Kouei Japan Trading | Get Quotation.

Shinko Seiki STM Series Multi-Chamber Sputtering System

kvt part2 — Sun, 01 Nov 2020 15:09:09 +0000

Manufacturer: Shinko Seiki Co., Ltd.
Model: STM Series

Features

The STM series enables processing of glass and ceramic panels of up to 203 mm diagonal, as well as wafer substrates (φ76.2 to φ203.2 mm).
The STM series provides various selective functions so that it can be applied to basic research into future processing and various prototyping and production processes.
The STM series is built with modular units, with emphasis placed on reliability.
Maintenance can be performed separately on chambers, which both facilitates maintenance work and shortens maintenance and startup time.
Having the space-saving design and through-wall structure, the STM series is applicable to high-level cleanrooms.

Specifications

Model	STM5412	STM5213	STM4415
Substrate loading capacity	φ 125 mm substrate	φ 200 mm substrate	φ 200 mm substrate
Equipment configuration
Cassette chamber	1 chamber	1 chamber	1 chamber
Transfer chamber	1 chamber	1 chamber	1 chamber
Etching chamber	Option *1	1 chamber	1 chamber
Sputtering chamber	2 chamber	2 chamber	4 chamber
Cathode specification
1st sputtering chamber	φ 200 mm, 1 piece	φ 350 mm, 1 piece	φ 300 mm, 1 piece
2nd sputtering chamber	φ 100 mm, 3 piece	φ 350 mm, 1 piece	φ 300 mm, 1 piece
3rd sputtering chamber	–	–	φ 300 mm, 1 piece
4th sputtering chamber	–	–	φ 300 mm, 1 piece
Sputtering direction	Up	Up	Up
Process performance
Film thickness distribution	Within ±10% (φ100)	Within ±3% (φ180)	Within ±5% (φ180)
Etching distribution	Within ±10% (φ100) *2	Within ±10% (φ180)	Within ±10% (φ180)
Substrate heating	300℃	300℃	300℃
Ultimate vacuum pressure for each chamber
Cassette chamber	7.0×10⁻⁵ Pa or less	7.0×10⁻⁵ Pa or less	9.9×10⁻⁶ Pa or less
Transfer chamber	7.0×10⁻⁵ Pa or less	7.0×10⁻⁵ Pa or less	5.0×10⁻⁵ Pa or less
Etching chamber	7.0×10⁻⁵ Pa or less *2	7.0×10⁻⁵ Pa or less	9.9×10⁻⁶ Pa or less
Sputtering chamber	5.0×10⁻⁵ Pa or less	5.0×10⁻⁵ Pa or less	2.0×10⁻⁵ Pa or less
Operation mode	Fully automatic C to C sputtering	Fully automatic C to C sputtering	Fully automatic C to C sputtering

*1: When the etching chamber is installed, there is only 1 sputtering chamber.
*2: When the etching chamber is installed.

The post Shinko Seiki STM Series Multi-Chamber Sputtering System first appeared on Kouei Japan Trading | Get Quotation.

Shinko Seiki Valve (Vacuum Valve)

kvt part2 — Sun, 01 Nov 2020 14:47:16 +0000

Manufacturer: Shinko Seiki Co., Ltd.

Specifications

SV-L series

(mm)
Model	A	B	C
SV-1L	65	90	186
SV-2L	90	120	234
SV-3L	120	160	288
SV-4L	130	185	324
SV-6L	160	235	391.5
SV-8L	200	300	497
SV-10L	230	350	602

Manual high-vacuum valve
L-shaped valve (Standard shape of vacuum valve)

SNV-L series

Pneumatic high-vacuum valve
L-shaped valve (Standard shape of vacuum valve)
The solenoid valve voltage can be arbitrarily selected.
As an optional accessory, an opening/closing operation switch available.
Explosion-proof types are also available.

(mm)
Model	A	B	C
SNV-1L	65	90	207.5
SNV-2L	90	120	278.5
SNV-3L	120	160	349
SNV-4L	130	185	410.5
SNV-6L	160	235	478
SNV-8L	200	300	853
SNV-10L	230	350	1080

The post Shinko Seiki Valve (Vacuum Valve) first appeared on Kouei Japan Trading | Get Quotation.

Shinko Seiki SD Series Oil Diffusion Pumps

kvt part2 — Sun, 01 Nov 2020 08:55:04 +0000

Manufacturer: Shinko Seiki Co., Ltd.
Model: SD Series

Features

High exhaust rate
Oil vapor reverse flow is small.
Long operating-life of heater (Cast aluminum heater is used.)
High allowable backpressure (Side ejector type)

Specifications

Model	Inlet port diameter (mm)	Outlet port diameter (mm)	Pumping speed (L/s)	Ultimate pressure (Pa)	Required power (kW)	Oil volume (L)	Critical back pressure (Pa)	Cooling water flow rate (L/min)	Standard back pump model	Dimensions A(H)×B×C (mm)
SD−3	80	25	300	3×10⁻⁵	0.35	0.12	13	1.5	SVC−150	300×110×110
SD−4	100	25	450	3×10⁻⁵	0.4	0.18	13	2	SGR−500	335×130×150
SD−6	160	50	1000	3×10⁻⁵	0.55	0.45	13	3	SR−1500B	535×180×220
SD−8	200	50	1700	3×10⁻⁵	1.3	0.75	13	4	SR−1500B	565×220×230
SD−10	260	50	3000	3×10⁻⁵	1.5	1.3	13	5	SR−25BⅡ	630×260×270
SD−14	350	100	5000	3×10⁻⁵	2.6	2.7	13	8	SR−37BⅡ	830 (1100)×350×370
SD−16	400	100	7000	3×10⁻⁵	3.3	3.5	13	12	SR−75BⅡ	870 (1200)×380×400
SD−22	550	160	13000	3×10⁻⁵	6	6	10	15	SR−75BⅡ	1200 (1400)×480×600

The body of some models is made of stainless steel.

Model	Inlet port diameter (mm)	Outlet port diameter (mm)	Pumping speed (L/s)	Ultimate pressure (Pa)	Required power (kW)	Oil volume (L)	Critical back pressure (Pa)	Cooling water flow rate (L/min)	Standard back pump model	Dimensions H×L×M (mm)
SD−4H	120	42	600	3×10⁻⁵	0.65	0.2	40	2	SGR−500	313×170×120
SD−6H	170	54	1200	3×10⁻⁵	1	0.45	40	4	SR−1500B	415×240×150
SD−8H	220	54	2000	3×10⁻⁵	1.8	1	40	6	SR−1500B	450×300×220
SD−10H	270	84	3000	3×10⁻⁵	2.6	1.3	40	10	SR−25B II	575×370×250

The body is made of stainless steel.

The post Shinko Seiki SD Series Oil Diffusion Pumps first appeared on Kouei Japan Trading | Get Quotation.

Shinko Seiki SMB Series Vacuum Exhaust Unit

kvt part2 — Sun, 01 Nov 2020 07:48:08 +0000

Manufacturer: Shinko Seiki Co., Ltd.
Model: SMB Series

Specifications

Model	Back pump	Ultimate pressure (Pa) (Water ring type pump, at water temperature of 20℃)
SMB−200	SR−500	0.2
SMB−200	SW−100Ⅱ	4.3×10²
SMB−C06	SR−1500B	0.13
	SW−300	3.3×10²
	SMB−200〜SW−100Ⅱ	23
	SMB−200〜SAE−100Ⅱ〜SW−100Ⅱ	1.9
SMB−C15	SR−37BⅡ	0.13
	SW−600Ⅲ	2.9×10²
	SMB−C06〜SW−300	13
	SMB−C06〜SAE−300〜SW−300	1.9
SMB−C25	SR−75BⅡ	0.13
	SMB−C06〜SW−300	10
	SMB−C06〜SAE−300〜SW−300	1.9
SMB−5000	SRP−15000B	0.13
	SMB−C15〜SW−600	11
	SMB−C15〜SAE−600〜SW−600	1.6

The post Shinko Seiki SMB Series Vacuum Exhaust Unit first appeared on Kouei Japan Trading | Get Quotation.

Shinko Seiki SMB Series Mechanical Booster Pumps

kvt part2 — Sun, 01 Nov 2020 06:05:30 +0000

Manufacturer: Shinko Seiki Co., Ltd.
Model: SMB Series

Features

Extremely high exhaust performance
Easy operation and maintenance
Long operating-life
Compact body and low vibrations
Produces clean vacuum.
Safe horizontal posture

Specifications

SMB/SMB-C series

Model	Pumping speed (m³/h)		Ultimate pressure (Pa)	Inlet side critical pressure (Pa)		Motor (kW)	Standard back pump model	Rotating speed (min⁻¹)		Oil volume (L)	Min. cooling water (L/min)	Inlet port diameter	Outlet port diameter	Dimensions A×B×C (mm)	Weight (kg)
Model	50Hz	60Hz	Ultimate pressure (Pa)	50Hz	60Hz	Motor (kW)	Standard back pump model	50Hz	60Hz	Oil volume (L)	Min. cooling water (L/min)	Inlet port diameter	Outlet port diameter	Dimensions A×B×C (mm)	Weight (kg)
SMB−200	160	190	0.2	6.3	5.3	1.5 (4P)	SR−500	1450	1750	0.4	3	VG80	VF50	930×367×555	120
SMB−200	130	150	4.3×10²	13.3	13.3	1.5 (4P)	SW−100Ⅱ	2900	3500	0.5	3	VG80	VF80	898×447×360	160
SMB−C06	500	600	0.3	13.3	10.7	2.2 (2P)	SR−1500B	2900	3500	1.2	3	VG100	VF80	—	—
SMB−C06	500	600	3.3×10²	13.3	10.7	3.7 (2P)	SW−300	2900	3500	1.2	3	VG100	VF80	898×447×360	160
SMB−C15	1250	1500	0.13	1.5	1.3	5.5 (4P)	SR−37BⅡ	2900	3500	1.5	2	VG150	VF100	1075×527×470	270
SMB−C15	1250	1500	0.13	1.5	1.3	5.5 (4P)	SMB−C06～SW−300	2900	3500	2.0	3	VG150	VF100	1075×527×470	270
SMB−C25	2100	2500	0.13	1.6	1.6	7.5 (4P)	SR−75BⅡ	2900	3500	2	3	VG200	VF150	1246×574×500	400
SMB−C25	2100	2500	0.13	1.6	1.6	7.5 (4P)	SMB−C06～SW−300	2900	3500	2	3	VG200	VF150	1246×574×500	400
SMB−5000	4800	—	0.13	2.7	—	11 (4P)	SRP−15000B	1800	—	6	3	VG250	VF200	1400×1250×990	730
SMB−5000	4400	—	0.11	1.3	—	15 (4P)	SMB−C15～SW−600Ⅲ	1100	—	8	—	VF350	VF250	—	—
SMB−10000	10500	—	0.07	1.3	—	22 (4P)	SMB−C25～SRP−15000B	1100	—	8	—	VF350	VF250	1665×1790×1175	2500

※ Weight: Motor weight is not included.

SMB-CM series

SMB-C06M use a magnetic coupling, which enables the pumps be driven from atmospheric pressure.

SMB-D (DM) series (Aluminum direct-connection type booster pump)

The SMB-D (DM) series is made of aluminum as the principal material, resulting in light weight.
Using the magnetic coupling makes it possible to drive the pump from atmospheric pressure, resulting in approx. 50% reduction in exhaust time. (DM series)

Model	Pumping speed (m³/h)		Ultimate pressure (Pa)	Inlet side critical pressure (Pa)	Motor (2P) (kW)	Standard back pump model	Rotational speed (min⁻¹)		Oil volume (L)	Minimum cooling water volume (L/min)	Inlet port diameter	Outlet port diameter	Dimensions A×B×C (mm)	Weight (kg)
Model	50Hz	60Hz	Ultimate pressure (Pa)	Inlet side critical pressure (Pa)	Motor (2P) (kW)	Standard back pump model	50Hz	60Hz	Oil volume (L)	Minimum cooling water volume (L/min)	Inlet port diameter	Outlet port diameter	Dimensions A×B×C (mm)	Weight (kg)
SMB−100D (SMB−100DM)	75	90	10²	4×10³	0.75	SVC−300	2900	3500	0.2	3	VG50	VF40	580×237×228	20.4
SMB−100D (SMB−100DM)	70	80	4×10²	9.5×10³	0.75	SW−50	2900	3500	0.2	3	VG50	VF40	580×237×228	20.4
SMB−300D (SMB−300DM)	215	255	10²	4×10³	1.5	SR−800	2900	3500	0.34	3	VG80	VF50	712×275×282	35.0
SMB−300D (SMB−300DM)	200	240	4×10²	10.7×10³	1.5	SW−150	2900	3500	0.34	3	VG80	VF50	712×275×282	35.0
SMB−600D (SMB−600DM)	430	510	10²	2×10³	2.2	SR−1500B	2900	3500	0.6	3	VG100	VF80	780×353×342	57.6
SMB−600D (SMB−600DM)	400	480	4×10²	9.5×10³	2.2	SW−300	2900	3500	0.6	3	VG100	VF80	780×353×342	57.6

※ Weight: Motor weight is not included.
※ Weight of the SMB-DM series is slightly higher than the above.

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Shinko Seiki SW Series Water Ring Vacuum Pumps

kvt part2 — Sun, 01 Nov 2020 05:19:12 +0000

Manufacturer: Shinko Seiki Co., Ltd.
Model: SW Series

Features

Owing to the water seal, the pumps can exhaust inflammable and corrosive gases.
These water-ring type pumps are suitable for exhaust gas that contains steam and water droplets.
The 2-stage pump configuration exhibits high performance under 3 × 10⁴ Pa or lower pressures.

Specifications

Model	Exhaust rate L/min at 2×10³Pa	Achievable pressure Pa	Rotational speed min⁻¹	Motor kW	Water supply rate L/min	Intake port diameter	Exhaust port diameter	Weight kg
SW−S7	90 (50Hz) 105 (60Hz)	6.7×10³	2900 (50Hz) 3500 (60Hz)	0.4 (2P)	4	Rc¼(PT¼)	Rc¼(PT¼)	24
SW−S15	300 (50Hz) 350 (60Hz)	6.7×10³	2900 (50Hz) 3500 (60Hz)	0.75 (2P)	5	Rc¼(PT¼)	Rc¼(PT¼)	24
SW−25S	370 (50Hz) 450 (60Hz)	2.3×10³ 1.3×10³ (With ejector)	2900 (50Hz) 3500 (60Hz)	1.5 (2P)	6	VF25	Rp1(PS1)	50
SW−50S	700 (50Hz) 850 (60Hz)	2.3×10³ 1.3×10³ (With ejector)	2900 (50Hz) 3500 (60Hz)	2.2 (2P)	8	VF25	Rp1(PS1)	58
SW−100ⅡS	1250 (50Hz) 1500 (60Hz)	2.3×10³ 8×10² (With ejector)	1450 (50Hz) 1750 (60Hz)	3.7 (4P)	10	VF40	Rp2(PS2)	120
SW−150S	2100 (50Hz) 2500 (60Hz)	2.3×10³ 8×10² (With ejector)	1450 (50Hz) 1750 (60Hz)	5.5 (4P)	12	VF50	Rp2(PS2)	140
SW−200S	2500 (50Hz) 3000 (60Hz)	2.3×10³ 8×10² (With ejector)	1450 (50Hz) 1750 (60Hz)	7.5 (4P)	16	VF50	JIS10K-50A	185
SW−150S	2100 (50Hz) 2500 (60Hz)	2.3×10³ 8×10² (With ejector)	1450 (50Hz) 1750 (60Hz)	5.5 (4P)	12	VF50	Rp2(PS2)	140
SW−300S	4600 (50Hz) 5500 (60Hz)	2.3×10³ 8×10² (With ejector)	1450 (50Hz) 1750 (60Hz)	11 (50Hz) 15 (60Hz) (4P)	35	VF80	VG80	350
SW−600ⅢS	10000 (50Hz)	2.3×10³ 8×10² (With ejector)	950	30 (4P)	80	VF80	JIS10K-150A	700

The main material of SW−S7 and SW−S15 is BC (copper alloy).
Models SW−25S to SW−600ⅢS are made of cast iron; shafts and impellers are stainless steel.
Weight does not include motor weight.
VF/VG: Flange for JIS B 2290 (1998) vacuum equipment.

SW-AS series

Model	Exhaust rate L/min at 2×10⁴Pa		Achievable pressure Pa		Rotational speed min⁻¹		Motor kW	Water supply rate L/min	Intake port diameter	Exhaust port diameter	Weight kg
Model	50Hz	60Hz	Water temperature at 15℃	With ejector	50Hz	60Hz	Motor kW	Water supply rate L/min	Intake port diameter	Exhaust port diameter	Weight kg
SW−25AS	370	450	2.3×10³	1.3×10³	2900	3500	1.5 (2P)	6	VF25	Rp1(PS1)	50
SW−50AS	700	850	2.3×10³	1.3×10³	2900	3500	2.2 (2P)	8	VF25	Rp1(PS1)	58
SW−100AS	1350	1630	2.3×10³	8×10²	1450	1750	5.5 (4P)	12	VF50	JIS10K-50A	180
SW−200AS	2100	2700	2.3×10³	8×10²	1450	1750	7.5 (4P)	16	VF50	JIS10K-50A	185
SW−300AS	3700	4400	2.3×10³	8×10²	1450	1750	11 (50Hz) 15 (60Hz) (4P)	35	VF50	VG80	350

Weight: Motor weight is not included.
VF・VG: Flange for JIS B 2290 (1968) vacuum equipment.

SW-C series

Gases that have been sucked into a pump can dissolve or mix in with the sealing liquid, and consequently be discharged from the pump as exhaust gas.
This may cause environmental pollution depending on the type of gas.
To prevent this problem, the SW-C series pumps circulate the sealing liquid inside, thus posing no threat to the environment.
The sealing liquid is cooled by the heat exchanger. The circulating circuit is a sealed structure.

Model	Pumping speed (L/min at 2×10³Pa)		Ultimate pressure at water temperature of 15℃ (Pa)	Rotational speed (min⁻¹)		Motor (kW)	Standard sealing liquid circulation rate (L/min)	Cooling water flow rate for heat exchanger (L/min)	Weight (kg)
Model	50Hz	60Hz	Ultimate pressure at water temperature of 15℃ (Pa)	50Hz	60Hz	Motor (kW)	Standard sealing liquid circulation rate (L/min)	Cooling water flow rate for heat exchanger (L/min)	Weight (kg)
SW−25SC	370	450	2.3×10³	2900	3500	1.5 (2P)	7	12	135
SW−50SC	700	850	2.3×10³	2900	3500	2.2 (2P)	8	13	150
SW−100ⅡSC	1250	1500	2.3×10³	1450	1750	3.7 (4P)	18	17	255
SW−150SC	2100	2500	2.3×10³	1450	1750	5.5 (4P)	20	33	310
SW−200SC	2500	3000	2.3×10³	1450	1750	7.5 (4P)	25	45	450
SW−300SC	4600	5500	2.3×10³	1450	1750	11 (50Hz) 15 (60Hz) (4P)	50	80	770
SW−600ⅢSC	10000	–	2.3×10³	1000	–	30 (4P)	100	170	1650
SW−25ASC	370	450	2.3×10³	2900	3500	1.5 (2P)	7	12	135
SW−50ASC	700	850	2.3×10³	2900	3500	2.2 (2P)	8	13	150
SW−100ASC	1350	1630	2.3×10³	1450	1750	5.5 (4P)	20	33	380
SW−200ASC	2100	2700	2.3×10³	1450	1750	7.5 (4P)	25	45	450
SW−300ASC	3700	4400	2.3×10³	1450	1750	11 (50Hz) 15 (60Hz) (4P)	50	80	770

※ Weight: Motor weight is not included.

The post Shinko Seiki SW Series Water Ring Vacuum Pumps first appeared on Kouei Japan Trading | Get Quotation.

Shinko Seiki SGH Series Direct-Drive Oil Sealed Rotary Vacuum Pump

kvt part2 — Sun, 01 Nov 2020 04:49:24 +0000

Manufacturer: Shinko Seiki Co., Ltd.
Model: SGH Series

Features

Direct drive coupled with a motor. Mainly suitable for use at medium vacuum range (0.1~100Pa).
Have a built-in oil reverse flow preventive mechanism, which prevents vacuum oil from flowing back if accidentally stopped.
Low noise operation at ultimate pressure.
Gas ballast valve (option) is easily attachable.
Motors with special features or different voltage can be coupled.
Overhaul work can be easily achieved.
Oil mist trap (option) is available to reduce oil mist.
Compact design / air cooling system.

Specifications

Model	SGH-360	SGH-800	SGH-1300
Designed pumping speed (L/min)	60Hz 360	60Hz 800	60Hz 1,300
Designed pumping speed (L/min)	50Hz 300	50Hz 660	50Hz 1,080
Ultimate pressure (Pa)	(GB valve closed) 0.07	(GB valve closed) 0.07	(GB valve closed) 0.07
Ultimate pressure (Pa)	(GB valve opened) 1Pa order	(GB valve opened) 1Pa order	(GB valve opened) 1Pa order
Continuously operational pressure (Pa)	4000 or lower	4000 or lower	2000 or lower
Allowable exhaust time from atmosphere to continuously operational pressure	Within 1 hour	Within 30 minutes	Within 30 minutes
Oil quantity (L)	0.8	2.4～2.8	2.8～3.3
Motor (kW)	0.75 (4P)	1.5 (4P)	2.2 (4P)
Inlet port	KF25	VG50	VG50
Exhaust port	G1	VF50	VF50
Weight (pump only) (kg)	25	57	68
Weight with motor (TEFC) (kg)	41	80	101
Dimensions (mm)	L550×W244×H253	L702×W284×H325	L813×W290×H325

※GB valve stands for gas ballast valve.
※Motor of “Weight with motor” is TEFC indoor use.
In case of other types, the weight is different.

The post Shinko Seiki SGH Series Direct-Drive Oil Sealed Rotary Vacuum Pump first appeared on Kouei Japan Trading | Get Quotation.

Shinko Seiki Oil Sealed Rotary Vacuum Pumps

kvt part2 — Sun, 01 Nov 2020 04:17:15 +0000

Manufacturer: Shinko Seiki Co., Ltd.

Features

High durability and long operating-life
Excellent exhaust characteristics. Easy operation.
Applicable to vapor processing
The gas ballast valve prevents pump performance deterioration caused by condensable vapors condensing and mixing in with the oil, thus enabling the condensable vapors to be exhausted.

SR/SRP series (Swing piston type)

Model	Pumping speed (L/min)	Ultimate pressure (Pa)		Rotational speed (min^-1)	Motor (4P) (kW)	Oil volume (L)	Inlet port diameter	Outlet port diameter	Minimum cooling water volume (L/min)	Dimensions A×B×C (mm)	Weight (kg)
Model	Pumping speed (L/min)	Gas ballast valve (Closed)	Gas ballast valve (Opened)	Rotational speed (min^-1)	Motor (4P) (kW)	Oil volume (L)	Inlet port diameter	Outlet port diameter	Minimum cooling water volume (L/min)	Dimensions A×B×C (mm)	Weight (kg)
SR−500	550	6.7×10¹	1.3×10²	400	0.75	2.5	VG40	Rp1 (PS1)	−	660×380×560	74
SR−800	803	6.7×10¹	67	410	1.5	3.3	VG50	RP1 1/2 (PS1 1/2)	−	730×400×600	105
SR−1500B	1540	6.7×10¹	67	410	2.2	5	VG50	RP1 1/2 (PS1 1/2)	−	820×550×750	190
SR−20B II	2040	6.7×10¹	67	330	3.7	5.5	VG80	Rp2 (PS2)	5	677×552×870	260
SR−25B II	2520	6.7×10¹	67	410	3.7	5.5	VG80	Rp2 (PS2)	5	677×552×870	260
SR−30B II	3040	6.7×10¹	67	330	5.5	11	VG80	Rp2 (PS2)	5	775×590×910	400
SR−37B II	3740	6.7×10¹	67	410	5.5	11	VG80	Rp2 (PS2)	5	775×590×910	400
SR−60B II	6180	6.7×10¹	67	300	7.5	20	VG100	JIS10K−80A	5	910×720×1120	725
SR−75B II	7660	6.7×10¹	67	300	11	23	VG100	JIS10K−80A	5	910×720×1120	725
SRP−15000B	15300	5.3×10¹	53	370	22	54	VG150	JIS10K−120A	10	1210×1230×1680	1560

※Weight: Motor weight is not included.

SVC series (Rotary vane type)

Model	Pumping speed (L/min)	Ultimate pressure (Pa)		Rotational speed (min^-1)	Motor (4P) (kW)	Oil volume (L)	Inlet port diameter	Outlet port diameter	Dimensions A×B×C (mm)	Weight (kg)
Model	Pumping speed (L/min)	Gas ballast valve (Closed)	Gas ballast valve (Opened)	Rotational speed (min^-1)	Motor (4P) (kW)	Oil volume (L)	Inlet port diameter	Outlet port diameter	Dimensions A×B×C (mm)	Weight (kg)
SVC−150	158	6.7×10⁻²	1.3	530	0.4	1.8	φ 34	G1 (PF1)	500×300×370	39
SVC−300	315	6.7×10⁻²	1.3	530	0.75	2.1	φ 34	G1 (PF1)	560×330×370	43

※Weight: Motor weight is not included.

The post Shinko Seiki Oil Sealed Rotary Vacuum Pumps first appeared on Kouei Japan Trading | Get Quotation.

Shinko Seiki SSH Series Dry Vacuum Pumps

kvt part2 — Sun, 01 Nov 2020 03:43:35 +0000

Manufacturer: Shinko Seiki Co., Ltd.
Model: SSH Series

Features

Powered by a high-efficiency brushless DC motor
Reduce starting current by controlling the rotational speed of the brushless DC motor.
Users can select between “POWER MODE” and “ECONOMY MODE” even in normal operation. (The operating mode can be changed while the pump is running.)
We achieve hertz-free by resolving difference in performance between 50 Hz and 60 Hz areas.
Economy & Ecology
Economy: The power-saving effect is approx. ￥64,000 per year.
Ecology: CO2 emissions can be reduced by approx. 1,400 kg per year.
※In comparison to an induction motor (Assuming approx. 9,000 hours running per year)
Built-in controller
The SSH series pumps incorporate a pump controller that provides various protective features. External control is also available.

Specifications

Model		SSH100	SSH150	SSH200
Pumping speed (L/min)	POWER MODE	1300	2100	3000
Pumping speed (L/min)	ECONOMY MODE	1030	1710	2500
Ultimate pressure (Pa)	POWER MODE	0.8	0.7	0.6
Ultimate pressure (Pa)	ECONOMY MODE	1.0	0.9	0.9
Rotational speed (min^-1)	POWER MODE	3600	3600	3600
Rotational speed (min^-1)	ECONOMY MODE	3000	3000	3000
Maximum suction pressure (Pa)		1×10⁵ (Atmospheric pressure)
Motor capacity (kW)		3.7	5.5	7.5
Inlet port		NW50		NW80
Outlet port			NW40
Lubricating oil	Type of lubricating oil	NEOVAC EP-83
	Lubricating oil volume (L)	1	1.1	1.1
	Type of grease	Vacuum grease
	Grease volume (g)	40	50	50
Weight (kg)		240	310	400
Utilities
Power supply		3 phase 200～220/200～230V, 50/60Hz
Rated capacity (kVA)		5.5	9.1	12.2
Cooling water	Supply pressure (MPaG)	0.1～0.3
	Flowrate (L/min)	5		7
	Water supply temperature (°C)	5～30
	Connection diameter	Rc 3/8
N2 gas	Supply pressure (MPaG)	0.1～0.5
	Flowrate (L/min)	0～0.1
	Seal gas (L/min)	0～5
	Purge gas (L/min)	0～50
Connection diameter		Rc 3/8

The post Shinko Seiki SSH Series Dry Vacuum Pumps first appeared on Kouei Japan Trading | Get Quotation.

Shinko Seiki SST/SSX Series Dry Vacuum Pumps

kvt part2 — Sun, 01 Nov 2020 03:24:22 +0000

Manufacturer: Shinko Seiki Co., Ltd.
Model: SST/SSX Series

Features

ZERO EDGE screw
With the uniquely developed screw shape, the SST/SSX series pumps provide high discharge and high durability, thus enabling stable operation even in hard processes.
Pursuing ease of maintenance
The SST/SSX series pumps can be easily cleaned and disassembled in their installation sites, by using the breakthrough method that looks at details from the user’s point of view.
Various optional accessories
With various optional accessories such as a cleaning inlet pipe set, maintenance frame set, heater set, etc., the SST/SSX series pumps offer users optimized specifications.
Also, the SST/SSX series pumps can be equipped with various motors, such as outdoor types, pressure-resistant/explosion-proof types, high-efficiency types, etc.

Specifications

Model		SST100	SST150	SST200	SSX300
Pumping speed (L/min)	60Hz	1220	1970	2800	5000
Pumping speed (L/min)	50Hz	970	1610	2350	4000
Ultimate pressure (Pa)	60Hz	0.8	0.7	0.6	0.6
Ultimate pressure (Pa)	50Hz	1.0	1.0	0.9	0.9
Maximum suction pressure (Pa)		1×10⁵ (Atmospheric pressure)
Motor capacity (kW)		3.7	5.5	7.5
Inlet port (Connection diameter depends on accessories)		VG 50		VG 80
Outlet port (Connection diameter depends on accessories)		Rc 2
Lubricating oil	Type of lubricating oil	NEOVAC EP-83
	Lubricating oil volume (L)	1.0		1.1
	Type of grease	Special vacuum grease
	Grease volume (g)	40	50	50	30
Weight (kg)	Pump body	200	240	400	440
Weight (kg)	Maximum (Pump with all accessories)	300	400	560	550
Power supply	Specification, phase, frequency, voltage	3 phase, 50/60 Hz, 200V class or 400V class AC
Cooling water	Supply pressure (Pressure difference between inlet and outlet) (MPaG)	0.15~0.4 (Pressure loss: 0.15 MPa or less)
	Flow rate L/min	5 or more	7 or more
	Water supply temperature (°C)	5~40 (No condensation)
	Connection diameter (Depends on accessories)	Rc 3/8	Rc 3/4		Rc 1/2
Seal / Purge gas	Supply pressure (MPaG)	0.1~0.5
	Regulator adjusted pressure (MPaG)	0.1~0.05
	Flow rate	Seal gas (L/min)	0~5
	Flow rate	Purge gas (L/min)	0~50		0~100
	Connection diameter (Depends on accessories)	Rc 1/4		Rc 3/8

The post Shinko Seiki SST/SSX Series Dry Vacuum Pumps first appeared on Kouei Japan Trading | Get Quotation.