Kanto Kasei Ltd.
Kanto Kasei Thermal Compound
Manufacturer: Kanto Kasei Ltd.
Features
- The compound in paste form allows the thickness to be easily controlled, which makes a significant difference from heat-release sheets having the same thermal conductivity.
- The compound can be applied using a dispenser and can also be reworked, unlike adhesives, providing excellent usability.
Specifications
| Task | Recommendation | Usage Example |
|---|---|---|
| PCB board heat dissipation. Difficulty attaching thermal sheets. | Standard Type (0.83 W/m·K) High Thermal Conductivity Type (2.1 W/m·K) | Contact surface between IC and heat sink |
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