Manufacturer: Musashi Engineering, Inc.

Features

Improve yield through high-quality coating quality
■Full 3D alignment
・Automatic correction of workpiece difference and pallet array error.
・Full compensation for the variation of the device array.
■Class-maximum ±0.005mm repetitive positioning accuracy
■Edge detection function [NEW]
・Compatible with various work shapes.
■Equipped with synchro speed function
・Strengthen collaboration with Dispenser. Smoother application.
■Equipped with application pattern editing software MuCADV
・ Change the variety instantly.
・ It is possible to import DXF/Garber data.
・ Automatically generate a staggering array/multiple picking program.
・ Automatically generate chip patterns on the wafer.
・ Easy to apply in the application area / non-application area.