Shinko Seiki SDR Series Roll To Roll Sputtering System

Manufacturer: Shinko Seiki Co., Ltd.
Model: SDR Series

Specifications

ModelSDR series
Substrate width300 ~ 1000 mm
Substrate thickness20 ~ 50 µm
Substrate winding diameterφ 300 mm max.
Substrate core outer diameter6″ (≈ 150 mm)
Running speed0.5 ~ 20 m / min
Tension5 to 50 kgf / overall width
Sputter cathode pre-processing (Option)4 units max.

※ Various types of resins films and metal foils are applicable as base materials.

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