Shinko Seiki Vapor Deposition System For Lift-Off Process

Manufacturer: Shinko Seiki Co., Ltd.

Specifications

ModelAAMF–C1650SBRAAMF–C2265SBR
Throughputφ 3 inch: 7 substrates
φ 4 inch: 4 substrates
φ 3 inch: 12 substrates
φ 4 inch: 12 substrates
Film incident angle± 3° (within φ 3 inch)± 4° (within φ 3 inch)
Film thickness distribution± 5%± 2.5%
Ultimate vacuum pressure10−6 Pa order

 

REQUEST QUOTATION

PAYMENT

payment-methods

Return Top