SHINKO SEIKI CO.
Shinko Seiki Plasma CVD System
Manufacturer: Shinko Seiki Co., Ltd.
Specifications
| Target | For production |
|---|---|
| Allowable processing range | 600 × 600 (mm) |
| Processing time | Approx. 4.5 hours / batch (SiO2 15 µm forming process) |
| Film thickness distribution | 560 × 560 (mm) plane: ± 7% or less |
| Film thickness | 15 µm (SiO2) |
| Applied gas | Ar, N2O, SiH4 (Ar dilution), Nitrogen (For venting / purging) |
| Main exhaust vacuum pump | Oil diffusion pump (Optional: Turbo-molecular pump) |
| RF power supply for discharge | 13.56 MHz (1.5kW) |
| Substrate heater | Heating temperature: 360°C ± 10°C (380°C max.) |
| Operation | Fully automatic operation from touch panel |
