SHINKO SEIKI CO.
Shinko Seiki STM Series Multi-Chamber Sputtering System
Manufacturer: Shinko Seiki Co., Ltd.
Model: STM Series
Features
- The STM series enables processing of glass and ceramic panels of up to 203 mm diagonal, as well as wafer substrates (φ76.2 to φ203.2 mm).
- The STM series provides various selective functions so that it can be applied to basic research into future processing and various prototyping and production processes.
- The STM series is built with modular units, with emphasis placed on reliability.
- Maintenance can be performed separately on chambers, which both facilitates maintenance work and shortens maintenance and startup time.
- Having the space-saving design and through-wall structure, the STM series is applicable to high-level cleanrooms.
Specifications
| Model | STM5412 | STM5213 | STM4415 |
|---|---|---|---|
| Substrate loading capacity | φ 125 mm substrate | φ 200 mm substrate | φ 200 mm substrate |
| Equipment configuration | |||
| Cassette chamber | 1 chamber | 1 chamber | 1 chamber |
| Transfer chamber | 1 chamber | 1 chamber | 1 chamber |
| Etching chamber | Option *1 | 1 chamber | 1 chamber |
| Sputtering chamber | 2 chamber | 2 chamber | 4 chamber |
| Cathode specification | |||
| 1st sputtering chamber | φ 200 mm, 1 piece | φ 350 mm, 1 piece | φ 300 mm, 1 piece |
| 2nd sputtering chamber | φ 100 mm, 3 piece | φ 350 mm, 1 piece | φ 300 mm, 1 piece |
| 3rd sputtering chamber | – | – | φ 300 mm, 1 piece |
| 4th sputtering chamber | – | – | φ 300 mm, 1 piece |
| Sputtering direction | Up | Up | Up |
| Process performance | |||
| Film thickness distribution | Within ±10% (φ100) | Within ±3% (φ180) | Within ±5% (φ180) |
| Etching distribution | Within ±10% (φ100) *2 | Within ±10% (φ180) | Within ±10% (φ180) |
| Substrate heating | 300℃ | 300℃ | 300℃ |
| Ultimate vacuum pressure for each chamber | |||
| Cassette chamber | 7.0×10−5 Pa or less | 7.0×10−5 Pa or less | 9.9×10−6 Pa or less |
| Transfer chamber | 7.0×10−5 Pa or less | 7.0×10−5 Pa or less | 5.0×10−5 Pa or less |
| Etching chamber | 7.0×10−5 Pa or less *2 | 7.0×10−5 Pa or less | 9.9×10−6 Pa or less |
| Sputtering chamber | 5.0×10−5 Pa or less | 5.0×10−5 Pa or less | 2.0×10−5 Pa or less |
| Operation mode | Fully automatic C to C sputtering | Fully automatic C to C sputtering | Fully automatic C to C sputtering |
*1: When the etching chamber is installed, there is only 1 sputtering chamber.
*2: When the etching chamber is installed.
