Shinko Seiki SRV Series Batch Type Sputtering System

Manufacturer: Shinko Seiki Co., Ltd.
Model: SRV Series

Features

  • This series comes in a proven product lineup that allows users to select the best hardware, software and processes for a wide range of applications from research and development of a single substrate to full-scale mass-production.

Specifications

ModelSRV4310SRV6310SRV7310
TypeParallel plate typeParallel plate typeParallel plate type
Target
Cathode typePlanar magnetronPlanar magnetronRMC
Size × Quantityφ 100 mm × 3φ 150 mm × 3φ 200 mm × 3
Sputtering directionUpUpUp
Substrate loading capacityφ 320 mmφ 320 mmφ 520 mm
Substrate table
Rotary mechanism
Substrate heatingSubstrate table: 300℃Substrate table: 300℃Substrate table: 300℃
Film thickness distributionWithin ±10% (φ210)Within ±10% (φ300)Within ±10% (φ420)
Vacuum pumping system
Ultimate vacuum pressure6.0 × 10−5 Pa or less6.0 × 10−5 Pa or less6.0 × 10−5 Pa or less
Pumping timeUp to 9.9 × 104 Pa
Within 10 minutes
Up to 9.9 × 104 Pa
Within 10 minutes
Up to 9.9 × 104 Pa
Within 10 minutes
Main pumpCryo pumpCryo pumpCryo pump
Operation mode
Pumping operationAutomaticAutomaticAutomatic
Sputtering operationSemi-automatic (With timer)Semi-automatic (With timer)Semi-automatic (With timer)
Sputtering power supply
RF500W1kW3kW
DCOptionOptionOption
Gas supply system2 lines2 lines2 lines

 

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