SHINKO SEIKI CO.
Shinko Seiki SRV Series Sputtering System For R & D


Manufacturer: Shinko Seiki Co., Ltd.
Model: SRV Series
Specifications
Load lock type
| Model | SRL3320 | SDL4320 | STL5520 |
|---|---|---|---|
| Parallel plate type | Parallel plate type | Parallel plate type | |
| Target | Cathode type | ||
| Planar magnetron | Planar magnetron | Planar magnetron | |
| Size × Quantity | |||
| φ 75 mm × 3 | φ 100 mm × 3 | φ 75 mm × 5 | |
| Sputtering direction | Up | Up | Up |
| Substrate loading capacity | φ 180 mm × 1 | φ 200 mm × 1 | φ 200 mm × 1 |
| Substrate table | Rotary mechanism | ||
| ○ | ○ | ○ | |
| Substrate heating | |||
| Substrate table: 300℃ | Substrate table: 300℃ | Substrate table: 700℃ | |
| Film thickness distribution | Within ±5% (φ 50) | Within ±10% (φ 180) | Within ±10% (φ 200) |
| Transfer method | Transfer rods | Transfer rods | Multiple rods |
| Vacuum pumping system | Ultimate vacuum pressure | ||
| 8.0 × 10−5 Pa or less | 8.0 × 10−5 Pa or less | 8.0 × 10−5 Pa or less | |
| Pumping time | |||
| Up to 5.0 × 10−4 Pa Within 25 minutes | Up to 5.0 × 10−4 Pa Within 20 minutes | Up to 5.0 × 10−4 Pa Within 20 minutes | |
| Main pump | Turbo molecular pump | Turbo molecular pump | Turbo molecular pump |
| Operation mode | Pumping operation | ||
| Automatic | Automatic | Automatic | |
| Transfer operation | |||
| Manual | Manual | Automatic | |
| Sputtering operation | Semi-automatic (With timer) | Semi-automatic (With timer) | Automatic |
| Sputtering power supply | RF | ||
| 500W | Option | 500W | |
| DC | |||
| — | 3kW | 3kW | |
| Gas supply system | 2 lines | 2 lines | 2 lines |
Batch type
| Model | SRV3100 | SRV3300 | SRV4320 |
|---|---|---|---|
| Parallel plate type | Parallel plate type | Parallel plate type | |
| Target | Cathode type | ||
| Planar magnetron | Planar magnetron | Planar magnetron | |
| Size × Quantity | φ 75 mm × 1 | φ 75 mm × 3 | φ 100 mm × 3 |
| Sputtering direction | Up | Down | Up |
| Substrate loading capacity | φ 100 mm | φ 190 mm | φ 280 mm |
| Substrate table | Rotary mechanism | ||
| ○ | |||
| Substrate heating | |||
| Substrate table: 200℃ | Substrate table: 300℃ | Substrate table: 300℃ | |
| Film thickness distribution | Within ±10% (φ 50) | Within ±10% (φ 180) | Within ±10% (φ 200) |
| Vacuum pumping system | Ultimate vacuum pressure | ||
| 5.0 × 10−4 Pa or less | 5.0 × 10−4 Pa or less | 5.0 × 10−4 Pa or less | |
| Pumping time | |||
| Up to 9.9 × 10−4 Pa Within 20 minutes | Up to 9.9 × 10−4 Pa Within 20 minutes | Up to 9.9 × 10−4 Pa Within 20 minutes | |
| Main pump | Oil diffusion pump | Oil diffusion pump | Turbo molecular pump |
| Operation mode | Pumping operation | ||
| Manual | Manual | Manual | |
| Sputtering operation | |||
| Semi-automatic (With timer) | Semi-automatic (With timer) | Semi-automatic (With timer) | |
| Sputtering power supply | RF | ||
| 500W | 500W | 1kW | |
| DC | |||
| — | Option | Option | |
| Gas supply system | 1 lines | 2 lines | 2 lines |
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