SHINKO SEIKI CO.
Shinko Seiki Load-Lock Type Vapor Deposition System
Manufacturer: Shinko Seiki Co., Ltd.
Specifications
| Model | AAMF–C845SB–L | AAMF–C1065SB–L | AAMF–C1275SB–L | AAMF–C1260SB–M |
|---|---|---|---|---|
| Film forming system | Throughput | |||
| φ 2 inch: 6 substrates / dome | φ 3 inch: 10 substrates / dome | φ 4 inch: 10 substrates / dome | φ 8 inch: 20 substrates / cassette | |
| Film thickness distribution | ||||
| ± 10% | ± 5% | |||
| Evaporation method | ||||
| Electron beam gun | ||||
| Substrate heating | ||||
| 350°C | ||||
| Vacuum pumping system (Film forming chamber) | Ultimate vacuum pressure | |||
| 4.0 × 10−5 Pa or less | ||||
| Main pump | ||||
| Cryo pump | ||||
| Operation mode | Fully automatic | |||
| Transfer system | Dome transfer | Single wafer transfer (Cassette-to-Cassette) | ||
※ Various user-selected functions are available.
※ In addition to the above, various sizes are available.
