Nitolex Uplas Wheels

Manufacturer: Nitolex Corporation
Model: Uplas

Features

New Bond Wheels
Uplas wheels are high-performance wheels using a compound bond manufactured by sintering special ceramic and metal bonds with our original technology. Uplas wheels take advantage of extremely sharp ceramics bond and a metal bond with extended wheel life.

Characteristics of Uplas Bond

High performance
Excellent sharpness and longer wheel life are realized by the strong abrasive retention and moderate fructure of the bond.
Wide rang of applications
The bond strength can be adjusted over a wide range to adapt the wheel to a variety of materials and grinding conditions.
Easily Truing/Dressing
Truing with WA or GC wheels is twice as efficient and dressing with them is five or more times as efficient as with resin bonded wheels, increasing production capacity

Types of Bond

	Materials	Bonds
High-speed steel, sintered alloy, etc.	UB75 The sharpness and wheel life are maximized with grain sizes between #60 and #325.	FUB75 A modified version of UP75 with improved sharpness. Especially useful for harder materials.

Application

High-speed steel
NC tool grinder Makino CNR-60
Creep grinding – wet (straight oil)
Wheel speed: 24 m/s
Work speed: 20 mm/min
Depth of cut: 4 mm
Wheel: CBN 140 R 125
FUB75
1F1 75D x 12T x 20H x 10X

Types of Bond

Materials	Bonds	Bonds
Cemented carbide Cermet	UB75 The sharpness and wheel life are maximized with finer grain sizes between #270 and #1000.	RUB75 A modified version of UB75 bond with improved sharpness at #400 or coarser.
PCD/PCBN	UB73 Excellent surface quality and average performance of metal and vitrified bonds are obtained with grain sizes between #400 and #2500.
Alumina, silicon nitride, silicon carbide, etc.	KUB75 A bond specialized for ceramic materials at grain sizes between #60 and #1000, and ensuring excellent sharpness and wheel life, especially for resin bonds.
Others	CF50 Specialized for tungsten	UF50 · UB55 Supporting individual special applications

Applications

Cemented Carbide

Mitsubishi CNC cylindrical grinder A32-P
Cylindrical grinding
Wet (oil)
Improved stock removal rate 20%
Work diameter:16 mm
Stock Removal: 0.04 mm
Wheel speed: 30 m/s
Work speed: 15 m/min
Feed speed: 330 mm/min
Depth of cut: 20µm
Wheel: SD 800 N 100 UB75
Cermet

Surface finish	2S (excellent)
Sharpness	Low grinding noise / low chipping
Dressing interval	50 pieces (conventionally 25 pieces)

Makino C-40 Automatic Wet (water solution)
Creep grinding
Work Chip breaker
Feed speed: 15 mm/min
Depth of cut: 0.5mm
Wheel speed: 28 m/s
Wheel: SD 600 L 100 UB75
1A1 100D x 10T x 20H x 5X
Alumina
Okamoto surface grinder
Wet (water solution) traverse grinding
Wheel speed: 33 m/s
Work speed: 16 m/min
Feed speed: 20 mm/pass
Depth of cut: 10 µm
Wheel: SD 140 T 100 KUB75
1A1R 450D x 40T x 127H x 5X UPLAS WHEELS Silicon nitride
Centerless grinder Chubu Machinery Works
Wet (water solution)
Wheel speed: 25 m/s Feed speed: 17 mm/min
Depth of cut: 0.5 mm
Wheel: SD 120 T 125 KUB75
9A1 200D x 60T x 32H x 5X