Manufacturer: KOGANEI CORPORATION

Features

This solution enables non-contact transfer of delicate materials such as glass and semiconductor wafers. As a result, it protects sensitive surfaces during handling. In addition, it securely holds porous workpieces as well as relatively convex or concave shapes. Moreover, the system delivers a powerful suction force, ensuring stable and reliable operation.

At the same time, it leaves no pad contact marks or scratches on the workpiece, which helps maintain product quality. Furthermore, the design requires no maintenance, reducing downtime and operating costs. Because it does not draw in surrounding dust or particles, the picking surface remains clean, thereby supporting consistent performance and high cleanliness standards.

Specifications