Manufacturer: Musashi Engineering, Inc.

Features

• New structure that prevents clogging with particle-containing materials
  . This new, completely original structure was developed after thorough research into the causes of solder clogging. It can also stably dispense Ag paste and Au paste.
  It is not affected by unevenness.
  It can also handle workpieces with unevenness or gaps, which are difficult to achieve with printing processes.
• High-speed production is possible
  . There is no need to move the nozzle up and down during dispensing