Nok Corporation
Nok QLEASE Clay-Like Heat Transfer Material
Manufacturer: Nok.
Model: “QLEASE” clay type.
Features
- Because it is a soft clay, it has a high degree of freedom of deformation, and fills three-dimensional, curved surfaces, and complex spaces.
- Due to its low adhesion and good handling, it does not flow at room temperature and does not pump out at high temperatures.
- Since it has excellent reworkability, it does not pollute the process and does not pollute the installation site.
- Since it has electrical insulation, it can be used around electrical circuits and electronic components.
- It can be used in the temperature range of -40°C~200°C (some specifications).
Specifications
| Items | Units | General Grade | High Heat Conduction Grade<br>(Developed Products) | Dispenser Grade<br>(Developed Product) | Test Method |
|---|---|---|---|---|---|
| Color | — | White | White | White | — |
| Specific Gravity | — | 2.8 | 3.0 | 2.8 | — |
| Hardness (Immiscible Degree) | — | 120 | 120 | 220 | JIS K 2220 |
| Thermal Conductivity | W/m·K | 2.8 | 4.4 | 3.1 | Hot-Wire Method |
| Recommended Operating Temp. | °C | -40 ~ 200 | -40 ~ 200 | -40 ~ 150 | — |
| Volume Resistivity | Ω·cm | > 2.7 × 10¹³ | > 2.7 × 10¹³ | 7.6 × 10¹² | JIS K 6249 (Pre-process 105°C / 24h) |
| Breakdown Strength (AC) | kV/mm | 7.6 | 8.4 | 4.5 | JIS C 2110 |
| Withstand Voltage (1 min) | kV/mm | 6.5 | 7.0 | 9.5 | JIS C 2110 |
| Dielectric Property – Relative Permittivity | — | ||||
| • 100 Hz | 6.2 | 6.0 | 5.9 | ||
| • 1 kHz | 9.8 | 7.8 | 7.0 | JIS C 2138 | |
| • 1 MHz | 8.5 | 6.7 | 6.1 | ||
| Dielectric Property – Dielectric Tangent | — | ||||
| • 100 Hz | 0.023 | 0.011 | 0.006 | ||
| • 1 kHz | 0.321 | 0.111 | 0.010 | JIS C 2138 | |
| • 1 MHz | 0.351 | 0.105 | 0.008 | ||
| Flame Retardancy | — | V-0 | Equivalent | HBF | UL94 |
| Low-Molecular-Weight Siloxane (D3~D10) | ppm | 189 | 44 | 56 | 140°C × 10 min (GC/MS) |
