Shinko Seiki STL Series Load-Lock Type Sputtering System

Manufacturer: Shinko Seiki Co., Ltd.
Model: STL Series

Features

  • This system uses three cathodes (φ100 mm), thus is capable of forming multiple films.
  • Film thickness distribution is φ250 mm ±10%.
  • Because the transfer chamber and film forming chamber are always kept under vacuum, throughput time can be shortened.
  • This space-saving load-lock type sputtering unit enables real-time process verification from the touch panel.

Specifications

ModelSTL5321STL5111STL5311
TypeParallel plate typeParallel plate typeParallel plate type
Target
Cathode typePlanar magnetronRMCPlanar magnetron
Size × Quantityφ 100 mm × 3φ 350 mm × 1φ 100 mm × 3
Sputtering directionDownUpUp
Substrate loading capacityφ 27 mm tray × 16φ 27 mm tray × 16φ 100 mm wafer × 3
Substrate table
Rotary mechanismOption
Substrate heatingSubstrate table: 500℃Substrate table: 500℃Substrate table: 500℃
Film thickness distributionWithin ±10% (φ210)Within ±5% (φ200)Within ±10% (φ90)
Transfer methodRobotRobotTelescopic arm
Vacuum pumping system
Ultimate vacuum pressureUp to 2.0 × 10−5 PaUp to 2.0 × 10−5 PaUp to 2.0 × 10−5 Pa
Pumping timeUp to 5.0 × 104 Pa
Within 20 minutes
Up to 5.0 × 104 Pa
Within 20 minutes
Up to 5.0 × 104 Pa
Within 20 minutes
Main pumpTurbo molecular pumpCryo pumpCryo pump
Operation mode
Pumping operationAutomaticAutomaticAutomatic
Sputtering operationAutomaticAutomaticAutomatic
Sputtering power supply
RF500WOption500W
DC3kW15kW3kW
Gas supply system2 lines2 lines2 lines

 

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