SHINKO SEIKI CO.
Shinko Seiki STM Series Ultra-High Vacuum Sputtering System
Manufacturer: Shinko Seiki Co., Ltd.
Model: STM Series
Features
- This latest multi-chamber system is applicable with wafers up to 8 inch in diameter.
- It is intended for research and development of cutting-edge devices (magnetic devices, nitride semiconductors, oxide semiconductors, etc.)
Specifications
| Model | STM2323 |
|---|---|
| Substrate loading capacity | φ 100 mm max. |
| Equipment configuration | Load-lock chamber: 1 chamber |
| Cassette chamber: 1 chamber | |
| Transfer chamber: 1 chamber | |
| Sputtering chamber: 3 chamber | |
| Cathode specification | RMC |
| Sputtering direction | Down |
| Process performance | Film thickness distribution: Within ±5% (φ 65) |
| Etching distribution: Within ±10% (φ 65) | |
| Substrate heating: 500°C | |
| Ultimate vacuum pressure for each chamber | Load-lock chamber: 8.0 × 10−6 Pa or less |
| Cassette chamber: 4.0 × 10−6 Pa or less | |
| Transfer chamber: 1.0 × 10−7 Pa or less | |
| Sputtering chamber: 1.0 × 10−6 Pa or less | |
| Operation mode | Fully automatic C to C sputtering |
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