Japan, UHT CORPORATION
UHT CORPORATION 2Head 2Stage Laser Puncher LP-2S□D series Laser
Made in Japan
Manufacturer: UHT CORPORATION
Model: LP-2S208DJ / LP-2S208DK/ LP-2S108DJ / LP-2S108DK
Features
- Achieved super-high-speed processing for mass production.
- 4000PPS (galvo speed 2000PPS×2) in simultaneous double-head & double-stage processing
- Ultra-compact, automated all-in-one designSmall footprint of 1.7m2
Lightweight 1500 kg structure - Series development matched to hole diameter and processing conditions.
- Low running costSealed-off CO2 laser oscillator
Characteristics
- The original double-head optical scanning system controller and digital galvo scanner allow high-speed and high-accuracy processing.
- Scanning area : □50mm×2heads (LP-2S208D) □30mm×2heads (LP-2S108D)
Max. processing area in conjunction with XY stage : □220 mm×2 - Series lineup
- Microvias down to 50 um in diameter (Type LP-2S108D)
Guide hole trepanning (all types) - Compact, automated all-in-one design for easy installation
- Small footprint of 2300 (L) * 1600 (W) mm, 3.7 m2
Lightweight 2700 kg structure - High-stability and high-power CO2 laser
- Low running cost by adopting a sealed-o laser with long gas exchange intervals
- Safety
- Class-1 laser product in compliance with JIS
- Optional automation devices for double-head & double-stage type
- The cleaner unit can be installed. (OP.)
Suction table to customized processing pattern
Standard Specifications
| Model | LP-2S208DJ | LP-2S208DK | LP-2S108DJ | LP-2S108DK | |
|---|---|---|---|---|---|
| Work | Material | Ceramic green sheet (with or without PET film) | |||
| Punching area | Max. □220 mm (rectangle also available) | ||||
| Punching area Size, Thickness | Max. □230 mm (rectangle also available); Max. 0.5 mm | ||||
| Processing | Hole size | φ70～200μm | φ50～150μm | ||
| Mask change type (dependent on material, thickness, parameters) | |||||
| Method | Mask imaging (Max. 12 masks can be set.) | ||||
| Table | Suction table × 2 | ||||
| Capability | Punching accuracy | ±20μm(Image processing accuracy is included.) | |||
| Galvo processing speed | 2000PPS×2 heads (X axis 0.5mm pitch) | ||||
| Laser unit | Oscillator | RF excitation CO2 laser | |||
| Wave length | 10.6μm | 9.4μm | 10.6μm | 9.4μm | |
| Average output | over 400W | over 300W | over 400W | over 300W | |
| Cooling method | Water-cooled by special chiller set outside machine | ||||
| Optical unit | Number of processing heads | 2 head | |||
| Method | Digital galvanometer optical scanning system | ||||
| Scanning area | Max.□50mm | Max.□30mm | |||
| Laser focus adjustment | Electric(Set by software) | ||||
| Z axis | Method | Automatic focus adjustment of optical unit by work thickness setting | |||
| Image processing | Method | CCD cameras detect alignment marks on sheet surface. | |||
| Detection method | Binary centroid calculation / pattern matching | ||||
| Image processing camera | 2 × 2 sets | ||||
| Camera view | Narrow view:1.2×0.9mm Wide view:4.8×3.6mm | ||||
| Lighting | LED ring lighting (standard: red, OP:white,blue,green) | ||||
| Control | Control unit | UHT original controller | |||
| Operation | 6.5inch color touch panel | ||||
| Data editing | Dedicated software (on stand-alone PC) | ||||
| Data memory capacity | Max. 100,000 positions per file | ||||
| Network | Transmission of processing data from PC to machine via LAN. Up to 4 machines are manageable from PC. |
||||
| Dust collector(set outside machine) | From above/below workpieces and inside the machine by dedicated dust collector | ||||
| Dust proof measures | Air purge system inside optical unit, fθ lens protective glass, axis covers | ||||
| Safety device | Safety cover, Key switch, Safety interlock | ||||
| Laser display light | 2 colors of LED | ||||
| Laser class | Class-1 laser product in compliance with JIS | ||||
| Power source | 3φ AC200V ±10% 14kVA | ||||
| Air source | 0.4～0.7MPa(Clean air) | ||||
| Automation module | ST-DT(Stack loader) | ||||
| Machine | Size | W2300×D1600×H1400mm | |||
| Weight | Approx. 2700kg | ||||
| Working condition | Temperature | 10～35℃(22±2℃ recommended) | |||
| Humidity | 40～60%(Non-dewing) | ||||
| Vibration | There must be neither impact nor a vibration. | ||||
Options
- Mask
nominal dia: 1.4 – 4.0 mm, 0.1 mm increments, sizes to be specified(Square masks available) - Alignment & suction table
- Laser energy measurement function
- Cleaner unit
- *Power box
- *Control PC & Processing data creation software
- *CAD conversion software
- *Items with an asterisk are required for the first machine.
-
Outline Drawing
Example of floor layout
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