Made in: Japan
Manufacturer: WINOA IKK JAPAN CO., LTD
Model: H

Features

■Type H is thermosetting formaldehyde resin media.

■It is recommended for use in the aviation industry due to its excellent abrasive power.

■ Substrate thickness of at least 0.040 inch (1 mm) is covered, residual stress is unaffected. In the semiconductor industry, it is used to remove burrs and resin extrusions on epoxy packages, especially when type XH (melamine) is too abrasive.
■Type H complies with the MIL standard specifications, MIL-P-85891, Type II.

■It is fully polymerized and does not contain free formaldehyde.

■Anti-static processing is done.

Specifications

Physicochemical properties