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UHT CORPORATION Laser Puncher LP-S□D series Laser

Made in Japan
Manufacturer: UHT CORPORATION
Model:  LP-2S208DJ / LP-2S208DK/ LP-2S108DJ / LP-2S108DK

Features

  • Green sheets, materials for ceramic substrates and green sheet laminates
  • Speed-up is achieved by an optics system of original scanning control.
    Galvo speed 2000PPS
  • Ultra-compact, automated all-in-one design
    Small footprint of 1.7 m2
    Lightweight 1500 kg structure
  • Series development matched to hole diameter and processing conditions.
  • Low running cost
    Sealed-off CO2 laser oscillator
  • Characteristics

    – The original optical scanning system controller and digital galvo scanner allow high-speed and high-accuracy processing.
    Scanning area : □50mm (LP-S208D) □30mm (LP-S108D) Max. processing area in conjunction with XY stage : □220mm
    -Series lineup
    Microvias down to 50 um in diameter (Type LP-S108D)
    Guide hole trepanning (all types)
    -Ultra-compact, automated all-in-one design for easy installation and relocation
    Small footprint of 1400 (L) * 1200 (W) mm, 1.7 m2 Lightweight 1500 kg structure for easy relocation
    -High-stability and high-power CO2 laser
    Low running cost by adopting a sealed-off laser with long gas exchange intervals
    -Safety
    Class-1 laser product in compliance with JIS
    -Accommodating automation (OP.)
    The cleaner unit can be installed. (OP.)
    Suction table to customized processing pattern

Standard Specifications

Model LP-S208DJ LP-S208DK LP-S108DJ LP-S108DK
Work Material Ceramic green sheet(with or without PET film)
Punching area Max.□220mm(rectangle also available)
Externals・ Thickness Max.□230mm(rectangle also available);Max.0.5mm
Machining (Processing) Hole size φ70~200μm φ50~150μm
Mask change type(dependent on material, thickness, parameters)
Method Mask imaging(Max.12 masks can be set.)
Table Suction table
Capability Punching accuracy ±20μm(Image processing accuracy is included.)
Galvo speed 2000PPS(X axis 0.5mm pitch)
Laser unit Oscillator RF excitation CO2 laser
Wave length 10.6μm 9.4μm 10.6μm 9.4μm
Average output 250W 225W 250W 225W
Cooling method Water-cooled by special chiller set outside machine
Optical unit Number of processing heads 1head
Method Galvanometer optical scanning system
Scanning area Max.□50mm Max.□30mm
Laser focus adjustment Electric Set by software
Z axis Automatic focus adjustment of optical unit by work thickness setting
Image processing Method CCD cameras detect alignment marks on sheet surface.
Detection method Binary centroid calculation / pattern matching
Image processing camera Two
Camera view Narrow view:1.2×0.9mm Wide view:4.8×3.6mm
Lighting LED ring lighting (standard: red, OP:white,blue,green)
Control Control unit UHT original controller
Operation 6.5inch color touch panel
Data editing Dedicated software (on stand-alone PC)
Data memory capacity Max.100,000 positions per file
Network Transmission of processing data from PC to machine via LAN.
Up to 4 machines are manageable from PC.
Dust collector(set outside machine) From above/below workpieces and inside the machine by dedicated dust collector
Dust proof measures Air purge system inside optical unit, fθ lens protective glass, axis covers
Safety device Safety cover, Key switch, Safety interlock
Laser display light 2 colors of LED
Laser class Class-1 laser product in compliance with JIS
Power source 3φ AC200V ±10% 5kVA
Air source 0.4~0.7MPa(Clean air)
Automation module ST-DT(stack loader)
Machine Size W1400×D1200×H1400mm
Weight Approx. 1500kg
Working condition Temperature 10~35℃(22±2℃ recommended)
Humidity 40~60%(Non-dewing)
Vibration There must be neither impact nor a vibration.

Options

  • Mask
    nominal dia: 1.4 – 4.0 mm, 0.1 mm increments, sizes to be specified(Square masks available)
  • Alignment & suction table
  • Laser energy measurement function
  • Cleaner unit
  • *Power box
  • *CAD conversion software
  • *Control PC & Processing data creation software

*Items with an asterisk are required for the first machine.

Outline Drawing

Example of floor layout

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