HYPER SCAN-M4 Ultrasonic Flaw Detection Multi-System

Made in Japan
Manufacturer: Dia Electronics Application
Model: SCAN-M4

Feature:

The HYPER SCAN-M4 ultrasonic inspection multi-system increases productivity with its multi-channel (2CH, 4CH) system. The HYPER SCAN-M4 also offers a full range of software functions to assist in the detection and recognition of defects.

Secifications:

Usable probe	5-150MHz
Effective measurement range	350mm x 350m *Can be customized depending on the target work
Minimum inspection pitch	20 μm
Maximum robot speed	1000mm/s (not including acceleration/deceleration)
Equipment size	W970mm×D1130mm×H1480mm
others	Safety measures (light curtain), water tank lifting function

Use Cases

Power modules
Defect detection inside modules
Inspection of solder joint layer on chip/circuit board
Inspection of solder joint layer of base plate/board
Inspection of adhesive resin layer between module and base board
Internal inspection of modules with fins

Ceramic Components/Composite Materials
Ceramic/metal (copper, aluminum) bonding layer inspection
Peeling inspection of electrostatic chuck materials
Inspection of bonding between metal substrate circuits/base
Crack inspection of ceramics.

Software Functions

Partial magnification function When a range is specified in the flaw image, the area in question is enlarged and displayed.
Defect list display Binarizes defects within a specified range and displays a defect list.
Image display of selected defects Color image of selected defects is displayed on the image by specifying the defects in the list.
Dimension measurement function Measures the X,Y length of a rectangular range and the distance between two points.