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UHT CORPORATION Laser Puncher LP-S□D series Laser

Made in Japan
Manufacturer: UHT CORPORATION
Model:  LP-2S208DJ / LP-2S208DK/ LP-2S108DJ / LP-2S108DK

Features

  • Green sheets, materials for ceramic substrates and green sheet laminates
  • Speed-up is achieved by an optics system of original scanning control.
    Galvo speed 2000PPS
  • Ultra-compact, automated all-in-one design
    Small footprint of 1.7 m2
    Lightweight 1500 kg structure
  • Series development matched to hole diameter and processing conditions.
  • Low running cost
    Sealed-off CO2 laser oscillator
  • Characteristics

    – The original optical scanning system controller and digital galvo scanner allow high-speed and high-accuracy processing.
    Scanning area : □50mm (LP-S208D) □30mm (LP-S108D) Max. processing area in conjunction with XY stage : □220mm
    -Series lineup
    Microvias down to 50 um in diameter (Type LP-S108D)
    Guide hole trepanning (all types)
    -Ultra-compact, automated all-in-one design for easy installation and relocation
    Small footprint of 1400 (L) * 1200 (W) mm, 1.7 m2 Lightweight 1500 kg structure for easy relocation
    -High-stability and high-power CO2 laser
    Low running cost by adopting a sealed-off laser with long gas exchange intervals
    -Safety
    Class-1 laser product in compliance with JIS
    -Accommodating automation (OP.)
    The cleaner unit can be installed. (OP.)
    Suction table to customized processing pattern

Standard Specifications

ModelLP-S208DJLP-S208DKLP-S108DJLP-S108DK
WorkMaterialCeramic green sheet(with or without PET film)
Punching areaMax.□220mm(rectangle also available)
Externals・ ThicknessMax.□230mm(rectangle also available);Max.0.5mm
Machining (Processing)Hole sizeφ70~200μmφ50~150μm
Mask change type(dependent on material, thickness, parameters)
MethodMask imaging(Max.12 masks can be set.)
TableSuction table
CapabilityPunching accuracy±20μm(Image processing accuracy is included.)
Galvo speed2000PPS(X axis 0.5mm pitch)
Laser unitOscillatorRF excitation CO2 laser
Wave length10.6μm9.4μm10.6μm9.4μm
Average output250W225W250W225W
Cooling methodWater-cooled by special chiller set outside machine
Optical unitNumber of processing heads1head
MethodGalvanometer optical scanning system
Scanning areaMax.□50mmMax.□30mm
Laser focus adjustmentElectric Set by software
Z axisAutomatic focus adjustment of optical unit by work thickness setting
Image processingMethodCCD cameras detect alignment marks on sheet surface.
Detection methodBinary centroid calculation / pattern matching
Image processing cameraTwo
Camera viewNarrow view:1.2×0.9mm Wide view:4.8×3.6mm
LightingLED ring lighting (standard: red, OP:white,blue,green)
ControlControl unitUHT original controller
Operation6.5inch color touch panel
Data editingDedicated software (on stand-alone PC)
Data memory capacityMax.100,000 positions per file
NetworkTransmission of processing data from PC to machine via LAN.
Up to 4 machines are manageable from PC.
Dust collector(set outside machine)From above/below workpieces and inside the machine by dedicated dust collector
Dust proof measuresAir purge system inside optical unit, fθ lens protective glass, axis covers
Safety deviceSafety cover, Key switch, Safety interlock
Laser display light2 colors of LED
Laser classClass-1 laser product in compliance with JIS
Power source3φ AC200V ±10% 5kVA
Air source0.4~0.7MPa(Clean air)
Automation moduleST-DT(stack loader)
MachineSizeW1400×D1200×H1400mm
WeightApprox. 1500kg
Working conditionTemperature10~35℃(22±2℃ recommended)
Humidity40~60%(Non-dewing)
VibrationThere must be neither impact nor a vibration.

Options

  • Mask
    nominal dia: 1.4 – 4.0 mm, 0.1 mm increments, sizes to be specified(Square masks available)
  • Alignment & suction table
  • Laser energy measurement function
  • Cleaner unit
  • *Power box
  • *CAD conversion software
  • *Control PC & Processing data creation software

*Items with an asterisk are required for the first machine.

Outline Drawing

Example of floor layout

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